PC Board

Joint Reliability and Failure Prevention

PC Board strain gaging and data acquisition techniques were applied to measure solder joint reliability and component failure prevention during assembly, handling and testing operations; conforming to IPC/JEDEC-9704.

Dynamic Strain Measurements

Dynamic strain measurements were recorded for various manufacturing sequence processes, for identifying strain and correlating to specific sequence steps.

Moving Toward Lead-free Production

Lead-free solder alloys were utilized to increase stiffness, preventing appropriate stress distribution and more sensitive strain rate with greater potential for brittle fracture failures.

Surface Mount Component Testing

Using HITEC’S strain gage expertise and Instron® Test machine, Monotonic Bend Characterization per IPC/JEDEC-9702 were applied for testing surface-mount components attached to printed wiring boards.